We provide many different models of Anisotropic Conductive Film (ACF) Bonding Equipment which is used to connect TAB drivers, chip-on-film (COF) drivers, flex circuits and Chip-On-Glass (COG) drivers to corresponding pads on a customer’s product. Anisotropic conductive film is used throughout the world to connect TAB, COF and COG drivers to LCDs and OLEDs. But it is also used for flex and chip connections to PCBs, RFID chips and generally any circuitry that is a resident on a glass or ceramic substrate.

This equipment is popularly referred to as a “TAB bonder”. TAB bonders were created as an alternative to wire bonders, and found a very common use in LCD and OLED driver circuits. Our TAB bonders range from very inexpensive TAB bonders to high-volume TAB bonders used in 24/7 production settings.

We have a broad line of ACF bonding equipment which is sized to handle products as small as 0.1mm diagonal up to 100” diagonal. Our equipment can reliably bond flexes or devices with line spacing as small as 15um. Anisotropic conductive film bonding equipment is in use today worldwide building hundreds of millions of products monthly requiring the use of ACF. Contact us today to receive a current product list describing our ACF bonding equipment.




Provide individual ACF bonding equipment and LCD/OLED assembly line equipment and processes or full turnkey assembly lines to the clients site • Provide training to client’s engineers and line personnel • Provide process yield and maintenance support for client’s assembly lines.


Send us an email

If you would like to receive information about our products and services, or inquire about purchasing and sample requests, please fill out the form below. We generally respond to emails within 24-48 business hours. For faster response times, always call us directly.

* All fields are required.

"*" indicates required fields